PCB Manufacturing

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7. Micro-via technology allows the carrier board design to shorten the distance between grounding and signal layers, thereby improving RF/electromagnetic wave/electrostatic discharge (RFI/EMI/ESD) interference. The number of grounding wires can be increased to prevent the damage of components caused by instantaneous discharge due to static electricity accumulation. Distance, Static Electricity, Circuit Board, Manufacturing Process, Logic Board, Carrier Board, Manufacturing, Screen Printing, Multi Layering
The benefits of high-density SMT chip processing
7. Micro-via technology allows the carrier board design to shorten the distance between grounding and signal layers, thereby improving RF/electromagnetic wave/electrostatic discharge (RFI/EMI/ESD) interference. The number of grounding wires can be increased to prevent the damage of components caused by instantaneous discharge due to static electricity accumulation.
3. The use of high-density patches for the same electronic product scheme can reduce the size of the pcba circuit board and thus reduce the cost. High, Circuit, Density, Components, Logic, Electronic Products
The benefits of high-density SMT chip processing
3. The use of high-density patches for the same electronic product scheme can reduce the size of the pcba circuit board and thus reduce the cost.
3. It shortens the signal transmission distance and increases the speed, effectively improving the reliability. Turn Ons
The Product Feature of rigid PCB and Flex PCB
3. It shortens the signal transmission distance and increases the speed, effectively improving the reliability.
Home Décor, Décor, Home, Equipment, X Ray, Standing Desk, Desk
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Browser, List, Decor, Home Decor
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Coffee Machine, Appliances, Maker, Coffee Maker, Espresso Machine
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Consumer Electronics, Http 404, Pcb Board
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Printed Circuit Board, Pcb Design, Efficiency
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2. Welding defects caused by warpage Circuit boards and components are warped during the welding process, and defects such as virtual welding and short circuits are generated due to stress deformation. Warpage is often caused by an unbalanced temperature between the upper and lower parts of the board. For large PCBs, warping will also occur due to the board’s own weight falling. Welding, Welding Process, Circuits, Process
How to Avoid PCB Soldering Defects?
2. Welding defects caused by warpage Circuit boards and components are warped during the welding process, and defects such as virtual welding and short circuits are generated due to stress deformation. Warpage is often caused by an unbalanced temperature between the upper and lower parts of the board. For large PCBs, warping will also occur due to the board’s own weight falling.
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Optimal FR4 PCB Thickness for Industry Pioneers
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Optimal FR4 PCB Thickness for Industry Pioneers
Optimal FR4 PCB Thickness for Industry Pioneers
Optimal FR4 PCB Thickness for Industry Pioneers
Optimal FR4 PCB Thickness for Industry Pioneers
Optimal FR4 PCB Thickness for Industry Pioneers
Optimal FR4 PCB Thickness for Industry Pioneers
Optimal FR4 PCB Thickness for Industry Pioneers
Optimal FR4 PCB Thickness for Industry Pioneers
Optimal FR4 PCB Thickness for Industry Pioneers
Optimal FR4 PCB Thickness for Industry Pioneers
Optimal FR4 PCB Thickness for Industry Pioneers
1. Partial wetting Some areas of the welded surface are wetted, and some are not wetted. Phone Cases, Pattern, Case, Wet, Surface, Phone, Chips
the following are present on the surface of the pattern taken out of the molten solder bath
1. Partial wetting Some areas of the welded surface are wetted, and some are not wetted.
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3. The PCB board has oxidation phenomenon, that is, the pad is black and not bright, and the oxidation phenomenon can be removed by an eraser. Generally, when the PCB is damp, the small batch processing factory of SMT proofing is placed in a drying oven for drying. If there are oil stains, sweat stains and other contamination on the board, clean it with absolute ethanol. Sweat Stains, Electronic Devices, Functional Testing, Oil Stains
the cause and solution of virtual welding:
3. The PCB board has oxidation phenomenon, that is, the pad is black and not bright, and the oxidation phenomenon can be removed by an eraser. Generally, when the PCB is damp, the small batch processing factory of SMT proofing is placed in a drying oven for drying. If there are oil stains, sweat stains and other contamination on the board, clean it with absolute ethanol.
2. External performance: 1. Good wettability, the edge of the welding point should be thin; 2. The surface of SMT solder joints with good quality is complete and smooth and bright; 3. The appropriate amount of solder and the solder completely cover the soldering parts of the pads and leads, and the height of the components is moderate.​​ Soldering, Led, In The Heights
how should the quality of solder joints be detected?
2. External performance: 1. Good wettability, the edge of the welding point should be thin; 2. The surface of SMT solder joints with good quality is complete and smooth and bright; 3. The appropriate amount of solder and the solder completely cover the soldering parts of the pads and leads, and the height of the components is moderate.​​
Welding requirements and conventional welding process, the welding of components, the main attention is: master the heating time, use the appropriate temperature and good operation. Master, Attention
The Solder Joint Quality Inspection of Circuit Board SMT Processing
Welding requirements and conventional welding process, the welding of components, the main attention is: master the heating time, use the appropriate temperature and good operation.
Therefore, when engineers start to arrange the layout of the printed board and decide the overall layout, they should conduct a detailed analysis of the circuit principle, first determine the location of special components (such as large-scale ICs, high-power transistors, signal sources, etc.), and then Arrange other components and try to avoid factors that may cause interference. Boards, Printed Circuit, Higher Power
The Location and orientation of pcb board components
Therefore, when engineers start to arrange the layout of the printed board and decide the overall layout, they should conduct a detailed analysis of the circuit principle, first determine the location of special components (such as large-scale ICs, high-power transistors, signal sources, etc.), and then Arrange other components and try to avoid factors that may cause interference.
5. Allowing a large current to pass is also an indicator of the chip inductance. When the circuit needs to bear a large current, this indicator of capacitance should be considered. Mixers, Audio Mixer, Mixer, Inductor, Music Instruments
How to Choose the Chip Inductor for SMT Chip Processing?
5. Allowing a large current to pass is also an indicator of the chip inductance. When the circuit needs to bear a large current, this indicator of capacitance should be considered.
2. If the accuracy requirements for chip inductors are higher than ±5%, you need to order in advance. Vans, Technology, Semiconductor, Lagos
How to Choose the Chip Inductor for SMT Chip Processing?
2. If the accuracy requirements for chip inductors are higher than ±5%, you need to order in advance.
making pcb boards
The uniformity of the etching rate of the entire substrate is high, and the etching uniformity of the upper and lower parts of the substrate and the etching uniformity of the board surface are determined by the uniformity of the etchant. Siding, Substrate, Periodic Table
How To Avoid The Side Corrosion Process Of Pcb Processing
The uniformity of the etching rate of the entire substrate is high, and the etching uniformity of the upper and lower parts of the substrate and the etching uniformity of the board surface are determined by the uniformity of the etchant.